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INTEGRATED CIRCUITS
NE/SA5090 Addressable relay driver
Product data Supersedes data of 1994 Aug 31 File under Integrated Circuits; IC11 Data Handbook 2001 Aug 03
Philips Semiconductors
Philips Semiconductors
Product data
Addressable relay driver
NE/SA5090
DESCRIPTION
The NE/SA5090 addressable relay driver is a high-current latched driver, similar in function to the 9934 address decoder. The device has 8 open-collector Darlington power outputs, each capable of 150 mA load current. The outputs are turned on or off by respectively loading a logic "1" or logic "0" into the device data input. The required output is defined by a 3-bit address. The device must be enabled by a CE input line which also serves the function of further address decoding. A common clear input, CLR, turns all outputs off when a logic "0" is applied. The device is packaged in a 16-pin plastic DIP or SO package.
PIN CONFIGURATION
D1, N Packages
A0 1 A1 2 A2 3 Q0 4 Q1 5 16 15 14 13 12 11 10 9 VCC CLR CE D Q7 Q6 Q5 Q4
Q2 6 Q3 7
FEATURES
GND 8
* 8 high-current outputs * Low-loading bus-compatible inputs * Power-on clear ensures safe operation * Will operate in addressable or demultiplex mode * Allows random (addressed) data entry * Easily expandable * Pin-compatible with 9334 (Philips or Fairchild)
TOP VIEW
NOTE: 1. SOL - Released in Large SO package only.
SL00234
Figure 1. Pin Configuration
APPLICATIONS
* Relay driver * Indicator lamp driver * Triac trigger * LED display digit driver * Stepper motor driver
BLOCK DIAGRAM
CLR LATCH LATCH LATCH LATCH A1 1-OF-8 DECODER CONTROL GATE LATCH LATCH LATCH LATCH Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
CE A0
A2 D
INPUT STAGE VCC
OUTPUT STAGE
SL00235
Figure 2. Block Diagram
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853-0892 26833
Philips Semiconductors
Product data
Addressable relay driver
NE/SA5090
PIN DESIGNATION
PIN NO. 1-3 4-7, 9-12 13 SYMBOL A0-A2 Q0-Q7 D NAME AND FUNCTION A 3-bit binary address on these pins defines which of the 8 output latches is to receive the data. The 8 device outputs. The data input. When the chip is enabled, this data bit is transferred to the defined output such that: "1" turns output switch "ON" "0" turns output switch "OFF" 14 15 CE CLR The chip enable. When this input is low, the output latches will accept data. When CE goes high, all outputs will retain their existing state, regardless of address of data input condition. The clear input. When CLR goes low all output switches are turned "OFF". The high data input will override the clear function on the addressed latch.
ORDERING INFORMATION
DESCRIPTION 16-Pin Plastic Small Outline Large (SOL) Package 16-Pin Plastic Dual In-Line Package (DIP) 16-Pin Plastic Small Outline Large (SOL) Package 16-Pin Plastic Dual In-Line Package (DIP) TEMPERATURE RANGE 0 C to +70 C 0 C to +70 C -40 C to +85 C -40 C to +85 C ORDER CODE NE5090D NE5090N SA5090D SA5090N DWG # SOT162-1 SOT38-4 SOT162-1 SOT38-4
TRUTH TABLE
INPUTS CLR L L L L L L L H H H H H H H CE H L L L L L L H L L L L L L D X L H L H L H X L H L H L H A0 X L L H H H H X L L H H H H A1 X L L L L H H X L L L L H H A2 X L L L L H H X L L L L H H Q0 H H L H H H H QN-1 H L QN-1 QN-1 QN-1 QN-1 QN-1 QN-1 H L QN-1 QN-1 H L Addressable Latch Q1 H H H H L H H Q2 H H H H H H H OUTPUTS Q3 H H H H H H H Q4 H H H H H H H Q5 H H H H H H H Q6 H H H H H H H Q7 H H H H H H L Memory Demultiplex Clear MODE
NOTES: X=Don't care condition QN-1=Previous output state L=Low voltage level/"ON" output state H=High voltage level/"OFF" output state
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Philips Semiconductors
Product data
Addressable relay driver
NE/SA5090
ABSOLUTE MAXIMUM RATINGS
Tamb = 25 C, unless otherwise specified. SYMBOL VCC VIN VOUT IGND IOUT PD Supply voltage Input voltage Output voltage Ground current Output current Each output Maximum power dissipation, Tamb = 25 C (still-air)1 N package D package Ambient temperature range Junction temperature Storage temperature range Lead soldering temperature (10 sec. max) PARAMETER RATING -0.5 to +7 -0.5 to +15 0 to +30 500 200 UNIT V V V mA mA
1712 1315 0 to +70 150 -65 to +150 230
mW mW C C C C
Tamb Tj Tstg Tsld
NOTE: 1. Derate above 25 C at the following rates: N package at 13.7 mW/C D package at 10.5 mW/C
DC ELECTRICAL CHARACTERISTICS
VCC = 4.75 V to 5.25 V; 0 C Tamb +70 C, unless otherwise specified.1 SYMBOL PARAMETER Input voltage VIH VIL VOL High Low Output voltage Low Input current IIH IIL IOH ICCL ICCH High Low Leakage current Supply current All outputs low All outputs high No output load VCC = 5.25 V 35 22 60 50 315 mW mA VIN = VCC VIN = 0 V VOUT = 28 V <1.0 -3.0 5 10 -250 250 A A IOL = 150 mA, Tamb = 25 C Over temperature 1.05 1.30 1.50 V 2.0 0.8 V TEST CONDITIONS LIMITS Min Typ Max UNIT
PD Power dissipation NOTE: 1. All typical values are at VCC = 5 V and Tamb = 25 C.
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Philips Semiconductors
Product data
Addressable relay driver
NE/SA5090
SWITCHING CHARACTERISTICS
VCC = 5 V; Tamb = 25 C; VOUT = 5 V; IOUT = 100 mA; VIL = 0.8 V; VIH = 2.0 V. SYMBOL Propagation delay time tPLH tPHL tPLH tPHL tPLH tPHL tPLH tPHL Low-to-high1 High-to-low1 Low-to-high2 High-to-low2 Low-to-high3 High-to-low3 Low-to-high4 High-to-low4 Output Output Output Data Address CLR Output CE 900 130 920 130 900 130 920 1800 260 1850 260 1800 260 1850 ns ns ns ns PARAMETER TO FROM MIN TYP MAX UNIT
Switching setup requirements
tS( ) S(H) tS(A) tH(H) () tPW(E) Set-up time HIGH Set-up time LOW Address set-up time Hold time HIGH Hold time LOW Chip enable pulse width1 Chip enable Chip enable Chip enable Chip enable Chip enable High data Low data Address High data Low data 40 50 40 10 10 40 ns ns ns ns
NOTES: 1. See Turn-On and Turn-Off Delays, Enable-to-Output and Enable Pulse Width timing diagram. 2. See Turn-On and Turn-Off Delays, Data-to-Output timing diagram. 3. See Turn-On and Turn-Off Delays, Address-to-Output timing diagram. 4. See Turn-Off Delay, Clear-to-Output timing diagram. 5. See Set-up and Hold Time, Data-to-Enable timing diagram. 6. See Set-up Time, Address-to-Enable timing diagram.
FUNCTIONAL DESCRIPTION
This peripheral driver has latched outputs which hold the input date until cleared. The NE5090 has active-LOW, open-collector outputs, all of which are cleared when power is first applied. This device is identical to the NE590, except the outputs can withstand 28 V.
dissipation by the device is limited to 0.75 W at room temperature, and decreases as ambient temperature rises. The maximum die junction temperature must be limited to 165 C, and the temperature rise above ambient and the junction temperature are defined as: TR = JA x PD Tj = Tamb + tR For example, if we are using the NE5090 in a plastic package in an application where the ambient temperature is never expected to rise above 50 C, and the output current at the 8 outputs, when on, are 100, 40, 50, 200, 15, 30, 80, and 10 mA, we find from the graph of output voltage vs load current that the output voltages are expected to be about 0.92, 0.75, 0.78, 1.04, 0.5, 0.7, 0.9, and 0.4 V, respectively. Total device power due to these loads is found to be 473.5 mW. Adding the 200 mW due to the power supply brings total device power dissipation to 723.5 mW. The thermal resistances are 83 C per W for plastic packages. Using the equations above we find: Plastic TR=83x0.7235=60C Plastic TJ =50+60=100C Thus we find that TJ is below the 165 C maximum, and either package could be used in this application. The graphs of total load power versus ambient temperature would also give us this same information, although interpreting the graphs would not yield the same accuracy.
Addressable Latch Function
Any given output can be turned on or off by presenting the address of the output to be set or cleared to the three address pins, by holding the "D" input High to turn on the selected output, or by holding it Low to turn off, holding the CLR input High, and bringing the CE input Low. Once an output is turned on or off, it will remain so until addressed again, or until all outputs are cleared by bringing the CLR input Low while holding the CE input High.
Demultiplexer Operation
By holding the CLR and CE inputs Low and the "D" input High, the addressed output will remain on and all other outputs will be off.
High Current Outputs
The obvious advantage of this device over other drivers such as the 9334 and N74LS259 is the fact that the outputs of the NE5090 are each capable of 200 mA and 28 V. It must be noted, however, that the total power dissipation would be over 2.5 W if all 8 outputs were on together and carrying 200 mA each. Since the total power dissipation is limited by the package to 1 W, and since power dissipation due to supply current is 0.25 W, the total load power
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Philips Semiconductors
Product data
Addressable relay driver
NE/SA5090
TIMING DIAGRAMS
D tPW CE tPW
D
tPLH tPLH Q tPHL Q
tPHL
NOTE: Other Inputs: CLR = H, A = Stable
NOTE: Other Inputs: CE = I, CLR = H, A = Stable
Turn-On and Turn-Off Delays, Enable-to-Output and Enable Pulse Width
Turn-On and Turn-Off Delays, Data-to-Output
A CLR tPLH tPHL Q tPLH Q
A
NOTE: Other Inputs: CE = L, CLR = L, D = H
Turn-On and Turn-Off Delays, Address-to-Output
Turn-Off Delays, Clear-to-Output
D
CE
tSH
tSL
A
CE
Q
NOTE: Other Inputs: CLR = H, A = Stable
NOTE: Other Inputs: CLR = H
Set-up and Hold Time, Data-to-Enable Figure 3. Timing Diagrams
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EEEEEE EEEEEE
tS
EEE EEE EEE EEE EEE EEEEE EEE EEE EEEEE EEE
tHH tHL
Set-up Time, Address-to-Enable
SL00236
Philips Semiconductors
Product data
Addressable relay driver
NE/SA5090
TYPICAL APPLICATIONS
+ 5V +5V TO 28V DATA BUS 4 + 5V D A2 A1 A0 5090 CE CLR Q0 Q1 Q2 Q3 Q0 Q5 Q6 Q7 D A2 A1 A0 5090 CE CLR Q0 Q1 Q2 Q3 Q0 Q5 Q6 Q7 + 5V RL Q0 Q1 Q2 Q 5090 Q3 0 Q5 CE Q6 Q7 +28V
P
RELAY LOAD
Driving Simple Loads
IQ CONTROL
CLEAR
+5V
+5V
+5V
D
NOTE: A0, A1, A2 may be connected to the address bus if permitted by system design.
555
3-BIT COUNTER
A0 A1 A2 5090 CE CLR
Interfacing With a Microprocessor System
Q0 Q1 Q2 Q3 Q0 Q5 Q6 Q7
Operating in Demultiplex Mode
SL00237
Figure 4. Typical Applications
TYPICAL PERFORMANCE CHARACTERISTICS
Output Voltage vs Load Current
1.2 1.0
Total Load Power vs Temperature
1.0
TOTAL LOAD POWER (W)
OUTPUT VOLTAGE (V)
N PACKAGE 0.75
0.8 0C 25 C 0.6 70 C
0.50 F PACKAGE
0.25
0.4 0 50 100 150 200 0 25 50 75 100 125 TEMPERATURE (oC)
OUTPUT LOAD CURRENT (mA)
SL00238
Figure 5. Typical Performance Characteristics
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Philips Semiconductors
Product data
Addressable relay driver
NE/SA5090
SO16: plastic small outline package; 16 leads; body width 7.5 mm
SOT162-1
2001 Aug 03
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Philips Semiconductors
Product data
Addressable relay driver
NE/SA5090
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
2001 Aug 03
9
Philips Semiconductors
Product data
Addressable relay driver
NE/SA5090
Data sheet status
Data sheet status [1] Objective data Preliminary data Product status [2] Development Qualification Definitions This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Product data
Production
[1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825
(c) Koninklijke Philips Electronics N.V. 2001 All rights reserved. Printed in U.S.A. Date of release: 12-01
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
Document order number:
9397 750 09176
Philips Semiconductors
2001 Aug 03 10

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